TVS Diode Transient Voltage Suppressor Diode ESD5V3U4U-HDMI Uni-directional Ultra-low Capacitance ESD / Transient Protection Array ESD5V3U4U-HDMI Data Sheet Revision 1.1, 2012-07-03 Final Powermanagement & Multi-Market Edition 2012-07-03 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. ESD5V3U4U-HDMI Revision History Revision 1.0, 2012-06-30 Page or Item Subjects (major changes since previous revision) Revision 1.1, 2012-07-03 7 Figure 2-1 Trademarks of Infineon Technologies AG AURIXTM, BlueMoonTM, C166TM, CanPAKTM, CIPOSTM, CIPURSETM, COMNEONTM, EconoPACKTM, CoolMOSTM, CoolSETTM, CORECONTROLTM, CROSSAVETM, DAVETM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPIMTM, EiceDRIVERTM, eupecTM, FCOSTM, HITFETTM, HybridPACKTM, IRFTM, ISOFACETM, IsoPACKTM, MIPAQTM, ModSTACKTM, my-dTM, NovalithICTM, OmniTuneTM, OptiMOSTM, ORIGATM, PRIMARIONTM, PrimePACKTM, PrimeSTACKTM, PRO-SILTM, PROFETTM, RASICTM, ReverSaveTM, SatRICTM, SIEGETTM, SINDRIONTM, SIPMOSTM, SMARTiTM, SmartLEWISTM, SOLID FLASHTM, TEMPFETTM, thinQ!TM, TRENCHSTOPTM, TriCoreTM, X-GOLDTM, X-PMUTM, XMMTM, XPOSYSTM. Other Trademarks Advance Design SystemTM (ADS) of Agilent Technologies, AMBATM, ARMTM, MULTI-ICETM, KEILTM, PRIMECELLTM, REALVIEWTM, THUMBTM, VisionTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM, FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM, NUCLEUSTM of Mentor Graphics Corporation. MifareTM of NXP. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Satellite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM, PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM, WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 FinalData Sheet 3 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Uni-directional Ultra-low Capacitance ESD / Transient Protection Array 1 Uni-directional Ultra-low Capacitance ESD / Transient Protection Array 1.1 Features * * * * * * * ESD / Transient protection of high speed data lines exceeding: - IEC61000-4-2 (ESD): 20 kV (air / contact) - IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns) - IEC61000-4-5 (surge): 3 A (8/20 s) Maximum working voltage: VR = 5.3 V Very low reverse current: IR < 1 nA typ. Extremely low capacitance: 0.4 pF typ. (I/O to GND) Four-lines protection array with pad pitch = 0.5 mm Flow-through design for optimal PCB layout of differential lines Pb-free package (RoHS compliant) and halogen free package 1.2 * * * Application Examples Protection of high speed digital interfaces like: HDMI 1.3, HDMI 1.4a, MHL, DisplayPort, S-ATA, DVI, MIPI, MDDI USB2.0, 10/100/1000 Ethernet, FireWire 2 Product Description Pin 9 Pin 8 Pin 7 Pin 6 Pin 1 I/O Pin 2 I/O Pin 4 I/O Pin 5 I/O GND Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 a) Pin configuration b) Schematic diagram Figure 2-1 Pin Configuration and Schematic Diagram Table 2-1 Ordering information Type Package Configuration ESD5V3U4U-HDMI PG-TSLP-9-1 4 lines, uni-directional FinalData Sheet Pin 3 4 Marking code Z1 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics 3 Characteristics Table 3-1 Maximum Rating at TA = 25 C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. VESD - - 20 kV IPP - - 3 A Operating temperature range TOP -40 - 125 C Storage temperature 1) VESD according to IEC61000-4-2 2) IPP according to IEC61000-4-5 Tstg -65 - 150 C ESD (air / contact) discharge 1) Peak pulse current (tp = 8/20 s) 3.1 2) Electrical Characteristics at TA = 25 C, unless otherwise specified RDYN: Dynamic resistance IF VBR: Breakdown voltage VRWM: Maximum working voltage IPP VCL: Clamping voltage RDYN VFC: Forward clamping voltage I PP: Peak pulse current IF VCL VBR VRWM VR VF I RWM VF VFC IR VF: Forward voltage I F: Forward current RDYN VR: Reverse voltage I PP I R: Reverse current IR Diode_Charac teris tic_Curv e_Uni-directional. v sd Figure 3-1 Definitions of Electrical Characteristics Table 3-2 DC Characteristics at TA = 25 C, unless otherwise specified Parameter Symbol Values Unit Min. Typ. Max. Reverse working voltage VRWM - - 5.3 V Breakdown voltage 6 - - V VBR Note / Test Condition IBR = 1 mA (I/O to GND) Reverse current IR - <1 50 nA VR = 5.3 V (I/O to GND) FinalData Sheet 5 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics Table 3-3 RF Characteristics at TA = 25 C, unless otherwise specified Parameter Symbol 1) Line capacitance CL Values Min. Typ. Max. - 0.4 0.6 Unit Note / Test Condition pF VR = 0 V, f = 1 MHz (I/O to GND) 1) Line capacitance CL - 0.2 0.3 pF VR = 0 V, f = 1 MHz (I/O to I/O) 1) Total capacitance line to ground Table 3-4 ESD Characteristics at TA = 25 C, unless otherwise specified Parameter Symbol Clamping voltage1) VCL Values Min. Typ. Max. - 19 - Unit Note / Test Condition V IPP = 16 A (I/O to GND) - 28 - V IPP = 30 A (I/O to GND) Forward clamping voltage1) VFC - 10 - V IPP = 16 A (GND to I/O) - 17 - V IPP = 30 A (GND to I/O) Dynamic resistance 1) RDYN - 0.6 - - 0.5 - I/O to GND GND to I/O 1) Please refer to Application Note AN210 [1]. TLP parameter: Z0 = 50 , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP characteristic between IPP1 = 10 A and IPP2 = 40 A. FinalData Sheet 6 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics Typical Characteristics at TA = 25C, unless otherwise specified 10 -6 10 -7 10-8 IR [A] 3.2 10 10 -9 -10 10-11 25 50 75 100 125 150 TA [C] Figure 3-2 Reverse current: IR = f(TA) , VR = 5.3 V, (I/O to GND) 0.8 CL [pF] 0.6 0.4 0.2 0 0 0.5 1 1.5 2 2.5 VR [V] 3 3.5 4 4.5 5 Figure 3-3 Diode capacitance: CL = f(VR), (I/O to GND) FinalData Sheet 7 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics 0.7 0.6 CL [pF] 0.5 5.3V 0.4 0V 0.3 0.2 0.1 0 -50 -25 0 25 TA [C] 50 75 100 2000 2500 3000 Figure 3-4 Line capacitance: CL = f(TA) 0.6 0.5 CL [pF] 0.4 0V 5.3V 0.3 0.2 0.1 0 0 500 1000 1500 f [MHz] Figure 3-5 Line capacitance: CL = f(f), (I/O to GND) FinalData Sheet 8 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics RDYN=0.6 30 ITLP [A] 20 ESD5V3U4U-HDMI RDYN 15 20 10 10 5 0 0 5 10 15 20 25 VTLP [V] 30 35 40 Equivalent VIEC [kV] 40 0 Figure 3-6 Forward clamping voltage: ITLP = f(VTLP), (GND to I/O) [1] 20 ESD5V3U4U-HDMI RDYN RDYN=0.5 ITLP [A] 30 15 20 10 10 5 0 0 0 5 10 15 VTLP [V] 20 25 30 Equivalent VIEC [kV] 40 Figure 3-7 Reverse clamping voltage: ITLP = f(VTLP), (I/O to GND) [1] FinalData Sheet 9 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Characteristics 90 80 70 VCL [V] 60 VCL-max-peak = 82.2 [V] 50 VCL-30ns-peak = 17.3 [V] 40 30 20 10 0 -10 -100 0 100 200 300 400 500 tp [ns] 600 700 800 900 700 800 900 Figure 3-8 IEC61000-4-2 VCL = f(t), 8 kV positive pulse, (I/O to GND) 10 0 -10 VCL [V] -20 -30 VCL-max-peak = -76.1 [V] -40 -50 VCL-30ns-peak = -8.9 [V] -60 -70 -80 -90 -100 0 100 200 300 400 500 tp [ns] 600 Figure 3-9 IEC61000-4-2 VCL = f(t), 8 kV negative pulse, (I/O to GND) FinalData Sheet 10 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI VCL [V] Characteristics 110 100 90 80 70 60 50 40 30 20 10 0 -10 -100 VCL-max-peak = 104.8 [V] VCL-30ns-peak = 24.1 [V] 0 100 200 300 400 500 tp [ns] 600 700 800 900 700 800 900 VCL [V] Figure 3-10 IEC61000-4-2 VCL = f(t), 15 kV positive pulse, (I/O to GND) 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -100 VCL-max-peak = -105.1 [V] VCL-30ns-peak = -13.7 [V] 0 100 200 300 400 500 tp [ns] 600 Figure 3-11 IEC61000-4-2 VCL = f(t), 15 kV negative pulse, (I/O to GND) FinalData Sheet 11 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Application Information 4 Application Information +5V HDMI Source/Sink 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 TMDS Data2 ESD5V3U4U TMDS Data1 TMDS Data0 ESD5V3U4U TMDS Clock CEC SCL HDMI Type A Connector ESD5V3U4U SDA Hot Plug Detect TMDS Channels CEC Line N.C. DDC (IC Bus) DDC/CEC GND +5V Hot Plug Detect ESD5V3U1U Figure 4-1 4 lines, uni-directional ESD5V3U4U-HDMI For protection on the 5 V supply rail please refer to ESD5V3U1U- TVS diode data sheet. FinalData Sheet 12 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Ordering Information Scheme (Examples) 5 ESD Ordering Information Scheme (Examples) 0P1 RF - XX YY Package XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins) YY = Package family: LS = TSSLP LRH = TSLP For Radio Frequency Applications Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF) ESD 5V3 U n U - XX YY Package or Application XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins) YY = Package family: LS = TSSLP LRH = TSLP S = SOT363 U = SC74 XX = Application family: LC = Low Clamp HDMI Uni- / Bi-directional or Rail to Rail protection Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines) Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF) Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V) Figure 5-1 Ordering information scheme FinalData Sheet 13 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Package Information 6 Package Information 6.1 PG-TSLP-9-1 Bottom view 10.035 A (0.03) 0.59 5 6 0.5 B 7 4 0.94 0.025 1) 3 2 0.05 A B 0.4 0.025 1) 0.05 A B 4 x 0.5 = 2 (0.05) 0.05 MAX. 0.05 A B 8 1 2.3 0.035 0.31+0.01 -0.02 8 x 0.2 0.025 1) Top view 9 Pin 1 marking 8 x 0.35 0.025 1) 0.05 A B 1) Dimension applies to plated terminals TSLP-9-1-PO V02 Figure 6-1 PG-TSLP-9-1: Package overview 1 Copper 0.3 0.2 0.3 0.3 0.2 0.38 0.3 0.38 0.38 0.38 0.2 0.2 2.3 0.3 0.2 0.2 0.3 0.3 0.3 0.2 2.3 0.3 0.3 0.2 1 0.24 0.24 Stencil apertures Solder mask TSLP-9-1-FP V01 Figure 6-2 PG-TSLP-9-1: Footprint FinalData Sheet 14 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI Package Information 0.5 8 2.3 4 Pin 1 marking 1.6 TSLP-9-1-TP V03 Figure 6-3 PG-TSLP-9-1: Packing 1234567 Type code Data code (YYWW) Pin 1 marking TSLP-9-1-MK V02 Figure 6-4 PG-TSLP-9-1: Marking (example) FinalData Sheet 15 Revision 1.1, 2012-07-03 ESD5V3U4U-HDMI References References [1] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP Characterization Methodology FinalData Sheet 16 Revision 1.1, 2012-07-03 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG